SiC高溫氧化設備
所屬分類:
第一代半導體工藝設備
概要:
? 專門用于硅碳化合物(SiC) 的氧化處理,可實現(xiàn)SiC片在高溫真空環(huán)境下完成高溫氧化工藝。氧化工藝使用濕法氧化氣體或N2O、NO、NO2,是最安全的毒性氣體氧化爐 ? 設備適用于SiC基功率器件制造中的高溫氧化工藝環(huán)節(jié) ? 加熱腔與工藝腔獨立密閉設計,提供工藝腔的潔凈度
關(guān)鍵詞:
SiC高溫氧化
SiC高溫氧化設備
產(chǎn)品概述/Product Introduction:
♦ 專門用于硅碳化合物(SiC) 的氧化處理,可實現(xiàn)SiC片在高溫真空環(huán)境下完成高溫氧化工藝。氧化工藝使用濕法氧化氣體或N?O、NO、NO?,是最安全的毒性氣體氧化爐
Specially used for oxidation treatment of silicon-carbon compounds (SiC), which can realize the high-temperature oxidation process of SiC sheets in high-temperature vacuum environment. The oxidation process uses wet oxidation gas or N?O, NO and NO?, which is the safest oxidizing furnace for toxic gas.
♦ 設備適用于SiC基功率器件制造中的高溫氧化工藝環(huán)節(jié)
The equipment is suitable for the high temperature oxidation process in the manufacture of SiC-based power devices
♦ 加熱腔與工藝腔獨立密閉設計,提供工藝腔的潔凈度
The heating chamber and the process chamber are designed independently and sealed to provide the cleanliness of the process chamber
產(chǎn)品特點/Product Characteristics:
♦ 采用立式結(jié)構(gòu)、工藝控制好、溫度分布均勻、氣流穩(wěn)定
The vertical structure is adopted, the process is well controlled, the temperature distribution is uniform, and the airflow is stable
♦ Robot自動傳送(可選)
Robot Auto Transfer (Optional)
♦ 多點控溫,溫度均勻
Multi-point temperature control, uniform temperature
♦ 具有多種報警功能及安全保護功能
Has various alarm functions and safety protection functions
♦ 加熱腔與工藝腔獨立密閉設計,提供工藝腔的潔凈度
The heating chamber and the process chamber are designed independently to provide the cleanliness of the process chamber
技術(shù)指標/Technical Indicators:
晶片尺寸: 4/6英寸 Wafer size: 4/6 inches |
工作溫度范圍: 800-1500 °C Operating temperature range: 800-1500°C |
裝片量: 50/80片 Loading capacity: 50/80 tablets |
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應用范圍/Scope:
♦ 用于SiC基半導體材料的高溫氧化處理
Used for high temperature oxidation treatment of SiC-based semiconductor materials
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